Quick-Turn HDI PCB We Manufacture
A variety of boards/processes, specializing in difficult boards that others can’t handle!
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
Data Acquisition Motherboard
2L
TG170
2OZ
HDI PCB
2-N-2
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Affordable Prototype PcB Manufacturer in China
Date
Buyer Name
Layers
Size
Lead Time
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2019-08-08alexia 1320*10cm1-2 days
-
2019-08-23alexia 1420*10cm1-2 days
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2020-01-01alexia 1220*10cm1-2 days
-
2021-05-05alexia 1520*10cm1-2 days
-
2021-08-20alexia 1620*10cm1-2 days
-
2021-07-16alexia 1520*10cm1-2 days
-
2024-08-08alexia 1620*10cm1-2 days
-
2024-08-23alexia 1520*10cm1-2 days
-
2024-08-02alexia 1520*10cm1-2 days
-
2024-08-04alexia 1620*10cm1-2 days
753+
Last 30 days
5000+
Customers
99.8%
on time delivery
Quick-Turn PCB Prototype Orders
HDI PCB Structures We Support
We have the capacity to fabricate up to 30 layers of HDI PCB. Therefore, it all depends on your requirements. The table below shows the types of HDI structures we fabricate.
HDI PCB Structures | Microvia Categories | High-Volume Production | Small To Medium-Volume Production | Prototype | Availability |
---|---|---|---|---|---|
1+N+1 | Blind vias | Yes | Yes | Yes | Over 4 layers |
2+N+2 | Blind/buried staggered vias | Yes | Yes | Yes | Over 6 layers |
2+N+2 | Blind/buried stacked vias | Yes | Yes | Yes | Over 6 layers |
3+N+3 | Blind/buried stacked vias | / | Yes | Yes | Over 8 layers |
3+N+3 | Blind/buried stacked vias | / | / | Yes | Over 8 layers |
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HDI PCB Production Capacity
Serial No | Item | Technical Parameters |
---|---|---|
1 | Base Material | FR-4 | High Tg | Halogen-free | PTFE | Ceramic PCB | Polyimide |
2 | Board Type | PCB | FPC | R-FPC | HDI |
3 | Hignest Layer | 64Layer |
4 | Minimum base copper thickness | 1/3 OZ ( 12um ) |
5 | Maximum finished copper thickness | 8 OZ |
6 | Minimum trace / gap (Inner layer) | 2/2mil (H/H OZ base copper) |
7 | Maximum produce size | 609*889mm |
8 | Minimum trace / gap (Outer layer) | 2/2mil (1/3 OZ base copper) |
9 | Minimum distance from hole to inner conductor | 6mil |
10 | Minimum distance from hole to outer conductor | 6mil |
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