JH PCBA Rigid-Flex PCB

Mature different kind HF material mixed lamination technology: FR4+PTFE,FR4+408HR,FR4+ROGERS

3mil/3mil min trace w/s, impedance control tolerance within ±8%

Materials available: rogers, Shengyi, taconic, teflon, arlon, etc.

What is High Frequency (HF) PCB?

High Frequency (HF) PCB is that kind special circuit boards with high frequency > 1GHz, with relative high purchase price. The physical properties, precision, technology parameters requests of high frequency PCB is quite high, normally used in cars collision avoidance system, satellite system, 5G base station communication devices etc fields.

Keep them in mind when choosing high frequency PCB

Dielectric constant(Dk): DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay.

Dissipation Factor(Df): DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay.

Coefficient of thermal expansion: The Coefficient of thermal expansion should be the same with copper foil as much as possible because the difference will lead to copper foil separated in the changes of cold and heat.

Moisture Resistance: Moisture absorption must be low, or will result in Dk and Df loss when in a wet environment.

High quality material as high quality guarantee basis

Establish strategy long time partnership cooperation with famous material manufacturers, such as Rogers, Shengyi, Taconic, Teflon, Arlon, etc.

Equipped with full manufacturing equipment for communication industry PCB

Plasma desmear machine and VCP plating line to provide excellent uniformity of barrel copper thickness and high consistency of impedance value.

Exquisite technology to meet high quality communication PCBs request

  • Mature different kind HF material mixed lamination technology: FR4+PTFE,FR4+408HR,FR4+ROGERS
  • 3mil/3mil min trace w/s, impedance control tolerance within ±8%

Professional technology engineers good at the details how to control HF PCB good quality

  • Before solder mask, HF boards can’t be scrubbed, or will leads to poor adhesive force, so micro-etch by chemicals is the best way of coarsening.

 

  • Most material of HF PCB are PTFE, using normal milling cutter will cause much tiny burrs, so we use special double edged milling cutter to guarantee slot size tolerance±0.1mm and prevents tiny burrs.

 

  • The impedance control and trace width/spacing requests of HF PCB is quite strict, the tolerance just about 2%.

 

  • The copper adhesive force is not ideal because high frequency material special features when PTH process, so before PTH, all vias and boards surface need coarsening preprocessing by using plasma and so on advanced equipment to improve PTH hole copper and solder mask adhesive force.

Capability of High Frequency PCB

 Feature  Capability
 Layer Counts  1-36
 Normal Lead Time  4-6 Working Days
 Fast Lead Time  1-2 Working Days
 Materials  ISOLA, Shengyi, Rogers,
Nelco, Arlon etc.
 Copper Thickness(Finished)  1/3OZ-20OZ
 Overall Board Thickness  0.2-5MM
 Minimum Line/Track Width & Space  3Mil/3Mil
 Solder Mask Color  Green,black,blue.white,
red,yellow. glossy and matt etc.
 Legend/Silkscreen Color  White, yellow, black, etc
 Back drilling  ≤16mil
 Surface Treatment  Plating Gold, ENIG, Immersion
Tin&Silver etc.
 Qualifications  UL, ISO 14001:2015  IS9001:2015Certified
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Material for High Frequency PCB

Material for high frequency boards Order share εr, Dk-
Permittivity
Dk
Loss Tangent
Tg Td Value Thermal
conductivity
CTE-z (T < TG) Electric
Strength
Surface
Resistivity
Peel Strength
@10GHz @10GHz °C °C W/m*K ppm/°C KV/mm >N/mm
Rogers 4350B
HF Material
+++ 3,5 0,0037 280° 390° 0,69 32 31 5,7 x 10^9 0,9
Rogers 4003C
PTFE HF Material
++ 3,4 0,0027 280° 425° 0,71 46 31 4,2 x 10^9 1,1
Panasonic Megtron6
HF Material
+ 3,6 0,004 185° 410° 45 1 x 10^8 0,8
Rogers RO3003
PTFE ceramic-filled
+ 3,0 0,0013 500° 0,50 25 1 x 10^7 2,2
Rogers RO3006
PTFE ceramic-filled
o 6,2 0,002 500° 0,79 24 1 x 10^5 1,2
Rogers RO3010
PTFE ceramic-filled
o 10 0,0022 500° 0,95 16 1 x 10^5 1,6
Taconic RF-35
Ceramic
o 3,5** 0,0018* 315° 0,24 64 1,5 x 10^8 1,8
Taconic TLX
PTFE
o 2,5 0,0019 0,19 135 1 x 10^7 2,1
Rogers RO3001
Bonding Film for PTFE
2,3 0,003 160° 0,22 98 1 x 10^9 2,1
Taconic TLC
PTFE
3,2 0,24 70 1 x 10^7 2,1
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Construction examples for High Frequency PCB

 

Heat Generation Components
Heat Generation Components
High Frequency PCB Stack up

 

High Frequency PCB Main Application:

High Frequency

High Frequency

High Frequency

High Frequency

High Frequency

High Frequency

High Frequency

High Frequency

Feature: 2L RO4003C, Dk of 3.38+/-0.05, Dissipation factor of 0.0027 at 10 GHz, Thermal conductivity 0.71 W/M.K

Low Z-axis coeffcient of thermal expan-sion at 32 ppm/’℃

Application: lP Infrastructure

Feature: 2L RO3210, Dk of 10.2+/-0.30, Dissipation factor of 0.0027 at 10 GHz, Thermal conductivity 0.61 W/M.K

Application: Wireless telecommunications systems

Feature: RT/Duroid® 5880, Dk of 2.20+/-0.02, Dissipation factor of 0.0009 at 10 GHz, Thermal conductivity 0.20 W/M.K, Low moisture absorptionIsotropic

Application: 5G communication system

Feature: 2LRO4350B, Dk of 3.48+/-0.05, Dissipation factor of 0.0037 at 10 GHz, Thermal conductivity 0.69 W/M.K, Low Z-axis coefhcient of thermal expansion

Application: Communications system

Feature: 2L RO4003C, Dk of 3.38+/-0.05, Dissipation factor of 0.0027 at 10 GHz, Thermal conductivity 0.71 W/M.K

Low Z-axis coeffcient of thermal expan-sion at 32 ppm/’℃

Application: lP Infrastructure

Feature: 2L RO3210, Dk of 10.2+/-0.30, Dissipation factor of 0.0027 at 10 GHz, Thermal conductivity 0.61 W/M.K

Application: Wireless telecommunications systems

Feature: RT/Duroid® 5880, Dk of 2.20+/-0.02, Dissipation factor of 0.0009 at 10 GHz, Thermal conductivity 0.20 W/M.K, Low moisture absorptionIsotropic

Application: 5G communication system

Feature: 2LRO4350B, Dk of 3.48+/-0.05, Dissipation factor of 0.0037 at 10 GHz, Thermal conductivity 0.69 W/M.K, Low Z-axis coefhcient of thermal expansion

Application: Communications system